12-inch wafer compatible high-speed high-precision twin dispense die bonder
Ideal for bonding small pin ICs such as QFN.
◆Reduction of TCO through high throughput, small footprint, and shortened changeover time ◆Enhanced operability achieved with easy adjustments and rework functionality ◆Minimization between mount and preform to prevent changes over time and reduce unnecessary movements ◆Equipped with a newly developed twin dispense system to accommodate various pastes ◆Needleless pickup system (optional) enables damage-free pickup
- Company：キヤノンマシナリー
- Price：10 million yen-50 million yen
